Display unit and electronic apparatus

ABSTRACT

A display unit including a first substrate and a second substrate that are disposed to face each other, a first organic insulating layer on the first substrate, a plurality of light-emitting elements arrayed in a display region, the display region on the first organic insulating layer and facing the second substrate and a first moisture-proof film covering the first organic insulating layer in a peripheral region, in which the peripheral region is provided on the first substrate and surrounds the display region.

TECHNICAL FIELD

The technology relates to a display unit having a self-luminous-typelight-emitting element including an organic layer, and also to anelectronic apparatus provided with such a display unit.

BACKGROUND ART

An organic electroluminescence (EL) element, which emits light by usingan organic EL phenomenon of an organic material, includes an organiclayer in which an organic hole transport layer and an organic luminouslayer are laminated between an anode and a cathode. The organic ELelement has been receiving attention as a light-emitting element capableof achieving high-intensity light emission through low-voltage DCdriving. However, in a display unit (an organic EL display unit) usingthis organic EL element, deterioration of the organic layer in theorganic EL element occurs due to moisture absorption, leading to adecrease in light emission intensity or instability of light emission inthe organic EL element, for example. Therefore, this type of displayunit has disadvantages such as low stability over time and a short life.

Thus, Japanese Unexamined Patent Application Publication No. 2002-93576,for example, has proposed an organic EL display unit in which a covermaterial for the purpose of sealing is provided on anelement-formation-surface side of a substrate, on which side an organicEL element and other circuits are formed, and an edge section betweenthe substrate and the cover material is sealed by a sealant.JP2002-93576A has also proposed a configuration in which the outside ofthe sealant is covered with a hard carbon film serving as a protectivefilm that prevents entrance of water vapor and the like. Thisconfiguration makes it possible to completely shield the organic ELelement formed on the substrate from the outside, and prevent entranceof substances such as water and oxygen which accelerate deteriorationcaused by oxidation of the organic EL element.

Further, there has been also proposed an organic EL display unit of acomplete solid type in which a cover material for the purpose of sealingis adhered to an element-formation-surface side of a substrate with anadhesive interposed therebetween, on which side an organic EL elementand other circuits are formed.

Furthermore, there has been also proposed an organic EL display unit inwhich a separation groove, which separates an organic insulating filminto an inner region side and an outer region side thereof, is formed ata position surrounding a display region (i.e. on an outer edge side ofthe display region). See, for example, Japanese Unexamined PatentApplication Publications No. 2006-54111 and No. 2008-283222. Providingthis separation groove prevents water, which is present on the outerregion side in the organic insulating film, from entering the innerregion side (i.e. a display region side) by passing through the insideof this organic insulating film. Therefore, it is possible to suppressdeterioration of an organic layer (an organic EL element) resulting fromthe passage of the water, which is left in the display unit, through theorganic insulating film.

CITATION LIST Patent Literature [PTL 1]

-   Japanese Unexamined Patent Application Publication No. 2002-93576

[PTL 2]

-   Japanese Unexamined Patent Application Publication No. 2006-54111

[PTL 3]

-   Japanese Unexamined Patent Application Publication No. 2008-283222

SUMMARY Technical Problem

Meanwhile, in recent years, organic EL display units have been mountedon portable information terminals such as so-called tablet personalcomputers (PCs) and smartphones (multifunctional portable telephones).For this type of portable information terminal, it is difficult toincrease the size of a main body in view of portability. However, it isnecessary that an effective screen region be as large as possible, fromthe viewpoint of securing visibility and operability for users.Therefore, it is desired to provide a so-called slim bezel, i.e. toreduce an area occupied by a peripheral region except the effectivescreen region in the main body of the portable information terminal, asmuch as possible.

In a structure like those proposed by Japanese Unexamined PatentApplication Publications No. 2006-54111 and No. 2008-283222 mentionedabove, however, it is difficult to provide a slim bezel in a case wherean area mask is used to form a film of the organic layer or the like,such as a case of using a white organic EL element. In other words, inreality, it is necessary to form the above-described separation grooveat a position sufficiently away from the display region, consideringmisalignment of the area mask (a mask misalignment region) and awraparound (a tapered region) of the film. Thus, it is necessary tosecure a wide bezel (i.e. necessary to increase the distance between thedisplay region and the peripheral region), making it difficult toprovide a slim bezel. In addition, since it is necessary to increase thedistance between the display region and the peripheral region, watercontained in the organic insulating layer in this region (an internalregion of the separation groove) enters the organic layer, therebydeteriorating the organic layer.

It is desirable to provide a display unit having high reliability and alarger effective screen region while suppressing deterioration of alight-emitting element caused by water, and an electronic apparatusprovided with such a display unit.

Solution to Problem

A display unit according to an embodiment of the technology includes: afirst substrate and a second substrate that are disposed to face eachother; a first organic insulating layer provided on the first substrate;a plurality of light-emitting elements arrayed in a display region, inwhich the display region is provided on the first organic insulatinglayer and faces the second substrate; and a first moisture-proof filmcovering the first organic insulating layer in a peripheral region, inwhich the peripheral region is provided on the first substrate andsurrounds the display region.

An electronic apparatus according to an embodiment of the technology isprovided with a display unit. The display unit includes: a firstsubstrate and a second substrate that are disposed to face each other; afirst organic insulating layer provided on the first substrate; aplurality of light-emitting elements arrayed in a display region, inwhich the display region is provided on the first organic insulatinglayer and faces the second substrate; and a first moisture-proof filmcovering the first organic insulating layer in a peripheral region, inwhich the peripheral region is provided on the first substrate andsurrounds the display region.

In the display unit and the electronic apparatus according to theabove-described embodiments of the technology, the first organicinsulating layer in the peripheral region is covered with the firstmoisture-proof film. Therefore, the first organic insulating layer issufficiently shielded from outside air containing water.

Advantageous Effects of Invention

According to the display unit and the electronic apparatus in theabove-described embodiments of the technology, since the firstmoisture-proof film is provided, it is possible to effectively prevententrance of water from the peripheral region into the display regionwhile providing a simple configuration. Therefore, deterioration of thelight-emitting elements is prevented, which allows high reliability tobe realized while also achieving a slim bezel.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary, and are intended toprovide further explanation of the technology as claimed.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a diagram illustrating a configuration of a display unitaccording to an embodiment of the technology.

FIG. 2 is a diagram illustrating an example of a pixel driving circuitdepicted in FIG. 1.

FIG. 3 is a plan view illustrating a configuration of a display regiondepicted in FIG. 1.

FIG. 4 is a cross-sectional diagram illustrating a configuration of thedisplay region depicted in FIG. 1.

FIG. 5 is another cross-sectional diagram illustrating the configurationof the display region depicted in FIG. 1.

FIG. 6 is an enlarged cross-sectional diagram illustrating an organiclayer depicted in FIG. 4 and FIG. 5.

FIG. 7 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a first modification.

FIG. 8 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a second modification.

FIG. 9A is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a third modification.

FIG. 9B is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a fourth modification.

FIG. 9C is an enlarged cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a fifth modification.

FIG. 10 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a sixth modification.

FIG. 11 is a plan view illustrating a schematic configuration of amodule including the display unit according to any of theabove-described embodiment and the modifications.

FIG. 12 is a perspective diagram illustrating an appearance of atelevision receiver according to a first application example of thedisplay unit.

FIG. 13A is a first perspective diagram illustrating an appearance of adigital camera according to a second application example of the displayunit.

FIG. 13B is a second perspective diagram illustrating an appearance ofthe digital camera according to the second application example of thedisplay unit.

FIG. 14 is a perspective diagram illustrating an appearance of a laptopcomputer according to a third application example of the display unit.

FIG. 15 is a perspective diagram illustrating an appearance of a videocamera according to a fourth application example of the display unit.

FIG. 16A is a diagram illustrating appearances of a portable telephoneaccording to a fifth application example of the display unit, namely, afront view, a left-side view, a right-side view, a top view, and abottom view of the portable telephone in a closed state.

FIG. 16B is a diagram illustrating appearances of the portable telephoneaccording to the fifth application example of the display unit, namely,a front view and a side view of the portable telephone in an open state.

FIG. 17A is a first perspective diagram illustrating an appearance of atablet type PC according to a sixth application example using thedisplay unit.

FIG. 17B is a second perspective diagram illustrating an appearance ofthe tablet type PC according to the sixth application example using thedisplay unit.

FIG. 18 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a seventh modification.

FIG. 19A is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to an eighth modification.

FIG. 19B is an enlarged cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a ninth modification.

FIG. 20 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a tenth modification.

FIG. 21A is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to an eleventh modification.

FIG. 21B is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a twelfth modification.

FIG. 22A is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a thirteenth modification.

FIG. 22B is another cross-sectional diagram illustrating the main-partconfiguration of the display unit according to the thirteenthmodification.

FIG. 23 is a perspective diagram used to describe a method ofmanufacturing the display unit depicted in FIGS. 22A and 22B.

FIG. 24A is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a fourteenth modification.

FIG. 24B is another cross-sectional diagram illustrating the main-partconfiguration of the display unit according to the fourteenthmodification.

FIG. 25 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a fifteenth modification.

FIG. 26 is a perspective diagram used to describe a method ofmanufacturing the display unit depicted in FIG. 25.

FIG. 27 is a cross-sectional diagram illustrating a main-partconfiguration of a display unit according to a sixteenth modification.

DESCRIPTION OF EMBODIMENTS

An embodiment and application examples of the disclosure will bedescribed in detail with reference to the drawings. It is to be notedthat the description will be provided in the following order.

-   1. Embodiment (FIG. 1 to FIG. 10): a display unit-   2. Application examples of display unit (FIG. 11 to FIG. 17B):    electronic apparatuses

Embodiment (Overall Configuration Example of Organic EL Display Unit)

FIG. 1 illustrates an overall configuration example of an organic ELdisplay unit 1 (hereinafter simply referred to as the display unit 1)according to an embodiment of the technology. The display unit 1 may beused as an organic EL television receiver and has a display region 110Aon a substrate 111. In this display region 110A, a plurality ofsubpixels 10R, 10G, and 10B are arranged in a matrix. The subpixels 10Rdisplay red color, the subpixels 10G display green color, and thesubpixels 10B display blue color. Here, subpixels displaying the samecolor are arranged in a line in a Y direction, and this line is repeatedsequentially in an X direction. Therefore, each combination of threesubpixels aligned in the X direction forms a picture element (a pixel).Further, in a peripheral region 110B around (i.e. on an outer edge sideor an outer boundary side of) the display region 110A, a signal-linedriving circuit 120 and a scanning-line driving circuit 130 serving asdrivers for image display (a peripheral circuit 12B which will bedescribed later) are provided.

The signal-line driving circuit 120 supplies a pixel selected through asignal line 120A with a signal voltage of an image signal according toluminance information supplied from a signal supply source (notillustrated).

The scanning-line driving circuit 130 includes a shift register and thelike which sequentially perform shifting (transfer) of a start pulse insynchronization with an inputted clock pulse. When an image signal iswritten to each of the pixels, the scanning-line driving circuit 130scans the pixels row by row and supplies a scanning signal to eachscanning line 130A sequentially.

Within the display region 110A, a pixel driving circuit 140 is provided.FIG. 2 illustrates an example of this pixel driving circuit 140 (i.e. anexample of a pixel circuit of the subpixels 10R, 10G, and 10B). Thepixel driving circuit 140 is an active drive circuit formed below afirst electrode layer 13 described later (a pixel-driving-circuitformation layer 112 described later). This pixel driving circuit 140includes a drive transistor Tr1, a write transistor Tr2, and a capacitor(a retention capacitor) Cs provided therebetween. The pixel drivingcircuit 140 further includes a white organic EL element 10W (hereinaftersimply referred to as the EL element 10W) connected to the drivetransistor Tr1 in series, between a first power source line (Vcc) and asecond power source line (GND). In other words, each of the subpixels10R, 10G, and 10B is provided with this EL element 10W. The drivetransistor Tr1 and the write transistor Tr2 are each configured using atypical Thin Film Transistor (TFT), and may be each configured to have,but not limited to, an inverted staggered structure (a so-calledbottom-gate type) or a staggered structure (a top-gate type), forexample.

In the pixel driving circuit 140, a plurality of signal lines 120A arearranged in a column direction, and a plurality of scanning lines 130Aare arranged in a row direction. An intersection between each of thesignal lines 120A and each of the scanning lines 130A corresponds to anyone of the subpixels 10R, 10G, and 10B. Each of the signal lines 120A isconnected to the signal-line driving circuit 120, and an image signal issupplied from this signal-line driving circuit 120 to a source electrodeof the write transistor Tr2 through the signal line 120A. Each of thescanning lines 130A is connected to the scanning-line driving circuit130, and a scanning signal is sequentially supplied from thisscanning-line driving circuit 130 to a gate electrode of the writetransistor Tr2 through the scanning line 130A.

(Plane Configuration Example of Display Unit)

FIG. 3 illustrates a configuration example of the display region 110Aspreading in an XY plane. Here, there is schematically illustrated aplane configuration including the display region 110A and the peripheralregion 110B surrounding the display region 110A, when viewed from above.This display region 110A is in a state in which a second electrode layer16, a filling layer 18, and a sealing substrate 19 (all described later)are removed. In the display region 110A, a plurality of EL elements 10Ware arranged in the X direction and the Y direction as illustrated inFIG. 3, i.e. arranged in a matrix as a whole. To be more specific, theEL elements 10W include respective light-emitting sections 20, and oneEL element 10W is disposed for each of the subpixels 10R, 10G, and 10B.The light-emitting sections 20 are separated from one another anddefined by an aperture-defining insulating film 24.

In FIG. 3, a rectangle indicated by a broken line surrounding thelight-emitting section 20 represents a region where an organic layer 14is formed. Further, a rectangle indicated by a broken line surroundingthe region where the organic layer 14 is formed represents a regionwhere the first electrode layer 13 is formed. A part of the firstelectrode layer 13 is provided with a contact section 124 which mayestablish conduction with a source electrode of the drive transistorTr1, for example. It is to be noted that the number of subpixelsarranged in each of the X direction and the Y direction is setoptionally, without being limited to the number illustrated in FIG. 3.Further, four or more EL elements 10W may be included in one pixel byfurther providing subpixels which may display yellow and white, forexample.

(Cross-Sectional Configuration of Display Unit 1)

FIG. 4 illustrates a schematic configuration of an XZ section of a partin proximity to a border between the display region 110A and theperipheral region 110B, the XZ section being taken along a line IV-IVdepicted in FIG. 3. Further, FIG. 5 is a cross-sectional diagram of thedisplay region 110A illustrated in FIG. 3, taken along a line V-V.Furthermore, FIG. 6 illustrates an enlarged part of a cross-section ofthe organic layer 14 illustrated in FIG. 4 and FIG. 5.

The display unit 1 of the present embodiment may be of a top-surfacelight emission type (a so-called top emission type), in which colorlight of any of R (red), G (green), and B (blue) is emitted from the topsurface (the sealing substrate 19 facing the substrate 111) by using theEL element 10W described above and a color filter described later. Asillustrated in FIG. 4, in the display region 110A, a light-emittingelement formation layer 12 including the EL element 10W is formed on abase 11 in which the pixel-driving-circuit formation layer 112 isprovided on the substrate 111. On the EL element 10W, a moisture-prooffilm 17, the filling layer 18, and the sealing substrate 19 are providedin this order. The display region 110A and the peripheral region 110Bare partitioned by a seal section 23 provided along a peripheral edgesection on a counter surface 19S of the sealing substrate 19, thecounter surface 19S facing the substrate 111. In the EL element 10W, thefirst electrode layer 13 serving as an anode electrode, the organiclayer 14 including a luminous layer 14C (described later), and thesecond electrode layer 16 serving as a cathode electrode are laminatedin this order on a planarizing film 218 which is the uppermost layer ofthe pixel-driving-circuit formation layer 112. The organic layer 14 andthe first electrode layer 13 are separated for each of the EL elements10W, by the aperture-defining insulating film 24. It is to be noted thatthe planarizing film 218 and the aperture-defining insulating film 24may be both configured using, for example, an organic material withexcellent pattern precision such as polyimide, acrylic, and siloxane.Meanwhile, the second electrode layer 16 is provided as a layer commonto all the EL elements 10W. It is to be noted that illustration of adetailed configuration including the drive transistor Tr1 and the writetransistor Tr2 in the pixel-driving-circuit formation layer 112 isomitted in FIG. 4.

In the base 11, the pixel-driving-circuit formation layer 112 includingthe pixel driving circuit 140 is provided on the substrate 111. Thesubstrate 111 is a support in which the EL elements 10W are formed inarrays, and a material such as a film or a sheet made of quartz, glass,metallic foil, or resin, for example, may be used for the substrate 111.Among them, quartz and glass are preferable. In a case of using resin asthe material, examples may include methacryl resins represented bypolymethyl methacrylate (PMMA), polyesters such as polyethyleneterephthalate (PET), polyethylene naphthalate (PEN), and polybutylenenaphthalate (PBN), and polycarbonate resin. In this case, however, alaminated structure and a surface treatment which suppress permeabilityand gas permeability may be necessary. On a surface of the substrate111, a metal layer 211G serving as a gate electrode of the drivetransistor Tr1, a metal layer 221G (FIG. 5) serving as a gate electrodeof the write transistor Tr2, and the signal line 120A (FIG. 5) areprovided as metal layers of a first level layer. The metal layers 211Gand 221G as well as the signal line 120A are covered with a gateinsulating film 212 which may be made of a silicon nitride, a siliconoxide, or the like.

In regions on the gate insulating film 212, the regions corresponding tothe metal layers 211G and 221G, channel layers 213 and 223 which may bemade of a semiconductor film formed of amorphous silicon or the like areprovided, respectively. On the channel layers 213 and 223, insulatingchannel protective films 214 and 224 are provided to occupy channelregions 213R and 223R which are central regions of the channel layers213 and 223, respectively. Provided on both sides of the channelprotective film 214 are a drain electrode 215D and a source electrode215S, and also, provided on both sides of the channel protective film224 are a drain electrode 225D and a source electrode 225S. The drainelectrodes 215D and 225D as well as the source electrodes 215S and 225Smay be made of an n-type semiconductor film such as n-type amorphoussilicon. The drain electrode 215D and the source electrode 215S areseparated from each other by the channel protective film 214, and also,the drain electrode 225D and the source electrode 225S are separatedfrom each other by the channel protective film 224. End faces of thedrain electrode 215D and the source electrode 215S are apart from eachother with the channel region 213R interposed therebetween, and also,end faces of the drain electrode 225D and the source electrode 225S areapart from each other with the channel region 223R interposedtherebetween. Further, as metal layers of a second level layer, metallayers 216D and 226D serving as drain wiring as well as metal layers216S and 226S serving as source wiring are provided to cover the drainelectrodes 215D and 225D as well as the source electrodes 215S and 225S,respectively. The metal layers 216D and 226D as well as the metal layers216S and 226S each may have, for example, a structure in which atitanium (Ti) layer, an aluminum (Al) layer, and a titanium layer arelaminated in this order. Other than the metal layers 216D and 226D aswell as the metal layers 216S and 226S, the scanning line 130A (notillustrated) is also provided as the metal layer of the second levellayer. The metal layer 216S may be connected to connection wiring 31used for connection with an external element such as an FPC in theperipheral region 110B (FIG. 4).

The pixel driving circuit 140 may be entirely covered with a protectivefilm (a passivation film) 217 which may be made of, for example, aninorganic material of low water permeability, such as silicon oxide(SiOx), silicon nitride (SiNx), silicon oxynitride (SiNxOy), titaniumoxide (TiOx), and aluminum oxide (AlxOy). On the protective film 217,the planarizing film 218 having an insulation property is provided.Preferably, the planarizing film 218 may have extremely high surfacesmoothness. Further, the contact section 124 which is minute is providedin a partial region of the planarizing film 218 and the protective film217 (FIG. 4). The contact section 124 is filled with the first electrodelayer 13, so that conduction with the metal layer 216S forming thesource electrode of the drive transistor Tr1 is established.

The first electrode layer 13, which is a lower electrode formed on theplanarizing film 218, also functions as a reflective layer, andpreferably, may be configured using a material having highest possiblereflectance in order to increase luminous efficiency. Therefore, thefirst electrode layer 13 may be configured using, for example, a highreflectance material such as aluminum (Al) and aluminum neodymium alloy(AlNd). The first electrode layer 13 may be, for example, a layer whosethickness in a lamination direction (hereinafter simply referred to asthe thickness) is about 10 nm or more and 1,000 nm or less. The materialof the first electrode layer 13 is not limited to those mentioned above,and may be a simple substance or an alloy of metallic elements such aschromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu),tungsten (W), and silver (Ag). Further, the first electrode layer 13 mayhave a laminated structure including a metal film and a transparentconductive film. The metal film may be made of a simple substance or analloy of metallic elements described above, and the transparentconductive film may be made of indium tin oxide (ITO), indium zinc oxide(InZnO), a compound of zinc oxide (ZnO) and aluminum (Al), or the like.

The aperture-defining insulating film 24 is provided to fill a gapbetween the first electrode layer 13 as well as the organic layer 14 inthe EL element 10W and those in the EL element 10W next thereto, i.e. agap between the light-emitting sections 20. The aperture-defininginsulating film 24 is also called a partition, which secures insulationbetween the first electrode layer 13 and the second electrode layer 16,and defines an outline of the light-emitting section 20 of the ELelement 10W precisely. In other words, a light emission region isdefined by the aperture-defining insulating film 24. Theaperture-defining insulating film 24 further has a function of servingas a partition when ink-jet coating or nozzle coating is performed in amanufacturing process described later. It is to be noted that, althoughthe organic layer 14 and/or the second electrode layer 16 may beprovided not only on an aperture but also on the aperture-defininginsulating film 24, light emission occurs in only the light-emittingsection 20 corresponding to the aperture of the aperture-defininginsulating film 24.

The organic layer 14 may be seamlessly formed over the entire surface ofthe light-emitting section 20 defined by the aperture-defininginsulating film 24. The organic layer 14 may have a configuration inwhich a hole injection layer 14A, a hole transport layer 14B, theluminous layer 14C, and an electron transport layer 14D are laminated inthis order from the first electrode layer 13 side as illustrated in FIG.6, for example. However, layers other than the luminous layer 14C may beprovided as necessary.

The hole injection layer 14A is provided to increase hole injectionefficiency for the luminous layer 14C, and also serves as a buffer layerused to prevent leakage. The hole injection layer 14A may have athickness of, for example, preferably about 5 nm to about 100 nm, andmore preferably about 8 nm to about 50 nm. A material of the holeinjection layer 14A may be selected as appropriate considering arelationship with an electrode or a material of an adjacent layer.Examples of the material of the hole injection layer 14A may includepolyaniline, polythiophene, polypyrrole, polyphenylene vinylene,polythienylene vinylene, polyquinoline, polyquinoxaline as well as theirderivatives, electroconductive polymers such as a polymer including anaromatic amine structure in a main chain or a side chain,metallophthalocyanine (such as copper phthalocyanine), and carbon. In acase in which the material used for the hole injection layer 14A is apolymer material, a weight-average molecular weight (Mw) thereof may bein a range of about 10,000 to about 300,000, and in particular, may bepreferably in a range of about 5,000 to about 200,000. Further, anoligomer of about 2,000 to about 10,000 Mw may be used, but when Mw isless than 5,000, the hole injection layer might dissolve at the time offorming the hole transport layer and subsequent layers. When Mw exceeds300,000, film formation is likely to be difficult because the materialgels. Examples of a typical electroconductive polymer used as thematerial of the hole injection layer 14A may include polyaniline,oligoaniline, and polydioxythiophene such aspoly(3,4-ethylenedioxythiophene) (PEDOT). Other examples may include apolymer commercially available under the name “Nafion” (trademark) fromH. C. Starck GmbH located in Goslar, Germany, a polymer commerciallyavailable in a dissolved form under the product name “Liquion”(trademark), “EL source” (trademark) available from Nissan ChemicalIndustries, Ltd. located in Tokyo, Japan, and a conductive polymeravailable under the name “Verazol” (trademark) from Soken Chemical &Engineering, Co., Ltd. located in Tokyo, Japan.

The hole transport layer 14B is provided to increase hole transportefficiency for the luminous layer 14C. The hole transport layer 14B mayhave, for example, a thickness of preferably about 10 nm to about 200nm, and more preferably about 15 nm to about 150 nm, depending on theentire configuration of the element. As a polymer material of the holetransport layer 14B, a luminescent material soluble in an organicsolvent may be used. Examples of this luminescent material may includepolyvinylcarbazole, polyfluorene, polyaniline, polysilane as well astheir derivatives, polysiloxane derivatives having an aromatic amine ina main chain or a side chain, polythiophene as well as derivativesthereof, and polypyrrole. When the material used for the hole transportlayer 14B is a polymer material, a weight-average molecular weight (Mw)thereof may be preferably about 50,000 to about 300,000, and may be morepreferably about 100,000 to about 200,000. When Mw is less than 50,000,a low-molecular component of the polymer material is dropped at the timeof forming the luminous layer 14C, causing a dot in the hole injectionlayer 14A and the hole transport layer 14B, and therefore, it is likelythat initial performance of the organic EL element is reduced or theelement deteriorates. On the other hand, when Mw exceeds 300,000, it maybe difficult to form a film because the material gels. It is to be notedthat the weight-average molecular weight (Mw) is a value obtained bydetermining a weight-average molecular weight based on a polystyreneconversion, through Gel Permeation Chromatography (GPC), by usingtetrahydrofuran as a solvent.

The luminous layer 14C generates light when electron-hole recombinationis caused by application of an electric field. The luminous layer 14Cmay have a thickness of, for example, preferably about 10 nm to about200 nm, and more preferably about 15 nm to about 150 nm, depending onthe entire configuration of the element. The luminous layer 14C may beconfigured using a mixed material in which a low-molecular material isadded to a polymer (luminescent) material. Preferably, the low-molecularmaterial may be a monomer or an oligomer formed by combining about twoto ten units of this monomer, and may have a weight-average molecularweight of 50,000 or less. It is to be noted that this does notnecessarily exclude low-molecular materials having weight-averagemolecular weights falling outside the above-mentioned ranges. Theluminous layer 14C may be formed by, for example, a coating method suchas ink-jet coating. The luminous layer 14C may be formed by using amixture in which at least one of polymer materials and low-molecularmaterials is dissolved in an organic solvent such as toluene, xylene,anisole, cyclohexanone, mesitylene(1,3,5-trimethylbenzene),pseudocumene(1,2,4-trimethylbenzene), hydrobenzofuran,1,2,3,4-tetramethylbenzene, tetralin, cyclohexylbenzene,1-methylnaphthalene, p-anisyl alcohol, dimethylnaphthalene,3-methylbiphenyl, 4-methylbiphenyl, 3-isopropyl biphenyl, andmonoisopropylnaphthalene. As the polymer material of the luminous layer14C, thereby may be used, for example, a polyfluorene-based polymerderivative, a (poly)para-phenylene vinylene derivative, a polyphenylenederivative, a polyvinylcarbazole derivative, a polythiophene derivative,a perylene-based pigment, a coumarin-based pigment, a rhodamine-basedpigment, or any of these polymers doped with an organic EL material.Examples of this doping material may include rubrene, perylene, 9,10diphenyl anthracene, tetraphenylbutadiene, nile red, and coumarin 6.

Further, preferably, a low-molecular material may be added to thepolymer material of the luminous layer 14C. The low-molecular materialadded to the luminous layer 14C may be a material other than compoundsmade of molecules of high-molecular-weight polymer or condensationproduct that is produced as a result of repetition of the samechain-reaction or a similar chain-reaction by a low-molecular compound,i.e. a material whose molecular weight is substantially single. Inaddition, a new chemical bond between molecules by heating does notoccur, and the material exists in the form of single molecule.Preferably, such a low-molecular material may have a weight-averagemolecular weight (Mw) of 50,000 or less. This is because, as comparedwith materials of above 50,000 Mw, materials whose molecular weight issmall to some extent have various characteristics, and it is easy toadjust factors such as hole or electron mobility, a band gap, andsolubility in a solvent. Further, preferably, for the amount of thelow-molecular material added, a mixing ratio of the polymer material andthe low-molecular material used for the luminous layer 14C may be about10:1 or more and about 1:2 or less in weight ratio thereof. Some reasonsfor this are as follows. When the mixing ratio of the polymer materialand the low-molecular material is below 10:1, an effect produced by theaddition of the low-molecular material is low. On the other hand, whenthis mixing ratio is above 1:2, it is difficult to obtaincharacteristics of the polymer material serving as the luminescentmaterial. Usable examples of such a low-molecular material may includebenzine, styrylamine, triphenyl amine, porphyrin, triphenylene,azatriphenylene, tetracyanoquinodimethane, triazole, imidazole,oxadiazole, polyarylalkane, phenylenediamine, arylamine, oxazole,anthracene, fluorenone, hydrazone, stilbene as well as theirderivatives, and a monomer or an oligomer in a conjugated heterocyclicsystem such as a polysilane-based compound, a vinylcarbazole-basedcompound, a thiophene-based compound, and an aniline-based compound.More specific examples may include, but not limited to, alpha-naphthylphenyl phenylenediamine, porphyrin, metallotetraphenylporphyrin, metalnaphthalocyanine, hexacyanoazatriphenylene,7,7,8,8-tetracyanoquinodimethane (TCNQ),7,7,8,8-tetracyano-2,3,5,6-tetrafluoroquinodimethane (F4-TCNQ),tetracyano 4,4,4-tris(3-methyl phenyl phenylamino)triphenyl amine,N,N,N′,N′-tetrakis(p-tolyl)p-phenylenediamine,N,N,N′,N′-tetraphenyl-4,4′-diaminobiphenyl, N-phenylcarbazole,4-di-p-tolylaminostilbene, poly(para-phenylene vinylene), poly(thiophenevinylene), and poly(2,2′-thienyl pyrrole). It is to be noted that thelow-molecular material added to the luminous layer 14C may not be onlyone kind, and two or more kinds may be mixed and used.

As a luminous guest material of the luminous layer 14C, there may beused a material having high luminous efficiency, examples of which mayinclude a low-molecular luminescence material and an organic luminescentmaterial such as a phosphorescent dye and a metal complex. Here, aluminous guest material for blue may be a compound whose wavelengthrange of light emission has a peak in a range of about 400 nm to about490 nm. As such a compound, an organic substance such as a naphthalenederivative, an anthracene derivative, a naphthacene derivative, astyrylamine derivative, and a bis(azinyl)methane boron complex may beused. Among them, preferably, the compound may be selected from anaminonaphthalene derivative, an aminoanthracene derivative, anaminochrysene derivative, an aminopyrene derivative, a styrylaminederivative, and a bis(azinyl)methane boron complex.

The electron transport layer 14D is provided to increase electrontransport efficiency for the luminous layer 14C. Examples of thematerial of the electron transport layer 14D may include quinoline,perylene, phenanthroline, bisstyryl, pyrazine, triazole, oxazole,fullerene, oxadiazole, fluorenone, and their derivatives as well asmetal complexes. Specific examples may includetris(8-hydroxyquinoline)aluminum (abbreviated as Alq3), anthracene,naphthalene, phenanthrene, pyrene, anthracene, perylene, butadiene,coumarin, C60, acridine, stilbene, 1,10-phenanthroline, and theirderivatives as well as metal complexes.

An electron injection layer (not illustrated), which may be made of LiF,Li₂O, or the like, may be provided between the electron transport layer14D and the second electrode layer 16. This electron injection layer isused to increase electron injection efficiency, and may be provided overthe entire surface of the electron transport layer 14D. As the materialof this electron injection layer, there may be used lithium oxide (Li₂O)which is an oxide of lithium (Li), cesium carbonate (Cs₂CO₃) which is acomplex oxide of cesium (Cs), and a mixture of these oxide and complexoxide, for example. The electron injection layer is not limited to thematerials listed above. For instance, alkaline earth metals such ascalcium (Ca) and barium (Ba), alkali metals such as lithium and cesium,and metals having small work function such as indium (In) and magnesium(Mg) may be used. Further, oxides, complex oxides, fluoride, and thelike of these metals may be used as a simple substance. Furthermore, amixture or an alloy of these metals, oxides, complex oxides, andfluoride may be used for increasing stability.

It is to be noted that the organic layer 14 may further include otherhole transport layer in contact with the luminous layer 14C. This otherhole transport layer may be formed by vapor deposition and thus, it ispreferable to use a low-molecular material, in particular, a monomer.This is because polymerized molecules such as a polymer and an oligomerare likely to resolve during the vapor deposition. It is to be notedthat the low-molecular material used for this other hole transport layermay be a mixture of two or more materials different in molecular weight.As the low-molecular material used for this other hole transport layer,a material similar to the low-molecular material described above for theluminous layer 14C may be used. Thus, likewise, examples may include,but not limited to, benzine, styrylamine, triphenyl amine, porphyrin,triphenylene, azatriphenylene, tetracyanoquinodimethane, triazole,imidazole, oxadiazole, polyarylalkane, phenylenediamine, arylamine,oxazole, anthracene, fluorenone, hydrazone, stilbene as well as theirderivatives, and a monomer, an oligomer, or a polymer in a conjugatedheterocyclic system such as a polysilane-based compound, avinylcarbazole-based compound, a thiophene-based compound, and ananiline-based compound. More specific material examples may include, butnot limited to, alpha-naphthyl phenyl phenylenediamine, porphyrin,metallotetraphenylporphyrin, metal naphthalocyanine,hexacyanoazatriphenylene, 7,7,8,8-tetracyanoquinodimethane (TCNQ),7,7,8,8′-tetracyano-2,3,5,6-tetrafluoroquinodimethane (F4-TCNQ),tetracyano 4,4,4-tris(3-methyl phenyl phenylamino)triphenyl amine,N,N,N′,N′-tetrakis(p-tolyl)p-phenylenediamine,N,N,N′,N′-tetraphenyl-4,4′-diaminobiphenyl, N-phenylcarbazole,4-di-p-tolylaminostilbene, poly(para-phenylene vinylene), poly(thiophenevinylene), and poly(2,2′-thienyl pyrrole).

The second electrode layer 16 is a common electrode provided for two ormore or all of the EL elements 10W, and disposed to face the firstelectrode layer 13 in each of the EL elements 10W. The second electrodelayer 16 is formed to cover not only the organic layer 14 but theaperture-defining insulating film 24, and may have, for example, athickness of about 2 nm or more and about 15 nm or less. The secondelectrode layer 16 is a transparent electrode configured using aconductive material having translucency to light generated in theluminous layer. Therefore, preferably, the material may be, for example,ITO, a compound containing indium, zinc (Zn), and oxygen (e.g., IZO),ZnO (zinc oxide), and the like. Further, the second electrode layer 16may be, for example, a semi-permeable reflective film configured using asimple substance or an alloy of metallic elements such as aluminum (Al),magnesium (Mg), calcium (Ca), and sodium (Na). Suitable examples mayinclude an alloy of magnesium and silver (MgAg alloy), and an alloy ofaluminum (Al) and lithium (Li) (AlLi alloy). In a case of using an Mg—Agalloy, preferably, Mg:Ag in film ratio may fall in a range from about20:1 to about 1:1. Further, the second electrode layer 16 may be a mixedlayer containing an organic luminescent material such as a quinolinealuminum complex, a styrylamine derivative, and a phthalocyaninederivative. In this case, a layer having optical transparency such as alayer made of MgAg may be further provided as a third layer.

The moisture-proof film 17 covering the EL element 10W may be made of,for example, an inorganic material having low hygroscopicity such assilicon oxide (SiOx), silicon nitride (SiNx), silicon oxynitride(SiNxOy), titanium oxide (TiOx), and aluminum oxide (AlxOy).Alternatively, a metallic material such as aluminum may be used. Byproviding the moisture-proof film 17, the EL element 10W is shieldedfrom outside air, and entrance of water from an external environmentinto the EL element 10W inside is prevented. The moisture-proof film 17is almost uniformly formed to cover not only the second electrode layer16 but the aperture-defining insulating film 24 and the planarizing film218 (described later). In other words, the moisture-proof film 17 maycover the EL element 10W, the aperture-defining insulating film 24, andthe planarizing film 218 continuously from the display region 110A tothe peripheral region 110B. However, it is sufficient for themoisture-proof film 17 to cover at least the aperture-defininginsulating film 24 and the planarizing film 218 in the peripheral region110B. This is because, since the aperture-defining insulating film 24and the planarizing film 218 are both configured using the organicmaterials having high hygroscopicity as described above, it is necessaryto prevent the water from entering the inside of the EL element 10Wthrough these films. It is to be noted that when the aperture-defininginsulating film 24 is not present in the peripheral region 110B, it issufficient for the moisture-proof film 17 to cover the planarizing film218. Further, the moisture-proof film 17 may have a single-layeredstructure, but may have a multilayer structure when increasing thethickness. This is to reduce internal stress in the moisture-proof film17.

The filling layer 18 may be a transparent resin layer almost uniformlyformed on the moisture-proof film 17, and functions as a bonding layer.This filling layer 18 may be made of epoxy resin, acrylic resin, or thelike, for example, and may be preferably made of thermosetting resin,UV-curable resin, or the like. The filling layer 18 is sealed betweenthe base 11 and the sealing substrate 19.

The seal section 23 is provided at an edge section of the sealingsubstrate 19, and formed like a loop surrounding the display region110A. The seal section 23 is a member provided to seal each layerbetween the substrate 111 and the sealing substrate 19 from outside.This seal section 23 may also be made of, for example, a nonconductivematerial such as epoxy resin and acrylic resin. However, the sealsection 23 may be formed of a conductive bonding material. In this case,the seal section 23 is allowed to function as auxiliary wiringpreventing an outflow of the filling layer 18 as well as easing a dropin voltage of the second electrode layer 16.

The sealing substrate 19 seals the EL element 10W in corporation withthe filling layer 18 and the seal section 23. The sealing substrate 19may be configured using a material such as clear glass having highpermeability to each color light emitted from a red pixel 10R, a greenpixel 10G, and a blue pixel 10B. On a surface of this sealing substrate19, the surface being on the substrate 111 side, the color filter (notillustrated) and a BM layer (a light-shielding film) may be provided,for example. The color filter may include a red filter, a green filter,and a blue filter. Thus, white light emitted from the EL element 10W ineach of the red pixel 10R, the green pixel 10G, and the blue pixel 10Bpasses through the above-mentioned color filter of each color, so thatred light, green light, and blue light exit therefrom. Further, thesealing substrate 19 improves contrast by absorbing external lightreflected within the red pixel 10R, the green pixel 10G, and the bluepixel 10B as well as in the wiring therebetween. Furthermore, in thecounter surface 19S in a region between the display region 110A and theperipheral region 110B, a vernier 32 and a black matrix 33 may beprovided. The vernier 32 is used for alignment when bonding the sealingsubstrate 19. The black matrix 33 blocks unnecessary light. The redfilter, the green filter, and the blue filter may be each shaped like arectangle, for example, and may be formed seamlessly. The red filter,the green filter, and the blue filter may be each configured using resinmixed with a pigment, and so adjusted by selecting the pigment thatoptical transmittance in an intended red, green, or blue wavelengthregion is high while optical transmittance in other wavelength regionsis low. Furthermore, a wavelength range having high transmittance in thecolor filter and a peak wavelength L (lambda) of a spectrum of lightdesired to be extracted from a resonator structure agree with eachother. Thus, of external light entering from the sealing substrate 19,only light having a wavelength equal to the peak wavelength L of thespectrum of the light desired to be extracted passes through the colorfilter, and external light having other wavelengths is prevented fromentering the EL element 10W.

The light-shielding film may be configured using, for example, a blackresin film mixed with a black coloring agent and having an opticaldensity of one or more, or a thin-film filter using thin-filminterference. Use of the black resin film allows easy formation at lowcost and thus may be preferable. The thin-film filter may be, forexample, a filter in which a thin film made of metal, metal nitride, ormetal oxide is laminated as one or more layers, and attenuates light byutilizing thin-film interference. As the thin-film filter, specifically,a filter in which chromium and chromium oxide (III) (Cr₂O₃) arealternately laminated may be used.

The display unit 1 may be manufactured as follows, for example. A methodof manufacturing the display unit according to the present embodimentwill be described below with reference to FIG. 4 to FIG. 6.

First, on the substrate 111 made of the material described above, thepixel driving circuit 140 including the drive transistor Tr1 and thewrite transistor Tr2 is formed. Specifically, first, a metal film isformed on the substrate 111 by sputtering, for example. Next, the metallayers 211G and 221G and a part of the signal line 120A are formed onthe substrate 111 by patterning the metal film through use of, forexample, a photolithographic method, dry etching, or wet etching.Subsequently, the entire surface is covered with the gate insulatingfilm 212. Further, the channel layers, the channel protective films, thedrain electrodes as well as the source electrodes, and the metal layers216D and 226D as well as the metal layers 216S and 226S are formed, onthe gate insulating film 212, in this order into a predetermined shape.Here, a part of the signal line 120A and the scanning line 130A are eachformed as a second metal layer, together at the time of forming themetal layers 216D and 226D as well as the metal layers 216S and 226S. Inthis process, a connection section connecting the metal layer 221G andthe scanning line 130A, a connection section connecting the metal layer226D and the signal line 120A, and a connection section connecting themetal layer 226S and the metal layer 211G are formed beforehand.Subsequently, the protective film 217 is provided to cover the whole,which completes the pixel driving circuit 140. In this process, theaperture is formed in the protective film 217 by dry etching or thelike, at a predetermined position on the metal layer 216S.

After the pixel driving circuit 140 is formed, a photosensitive resinwhich may contain polyimide as a main component, for example, is appliedover the entire surface by spin coating or the like. Next, theplanarizing film 218 having the contact section 124 is formed bysubjecting the photosensitive resin to photolithography. Specifically,the contact section 124 which is in communication with the apertureprovided in the protective film 217 is formed by, for example, selectiveexposure and development using a mask having a hole at a predeterminedposition. Afterward, the planarizing film 218 may be subjected to firingas necessary. The pixel-driving-circuit formation layer 112 is therebyobtained.

Further, the first electrode layer 13 made of the predetermined materialdescribed above is formed. Specifically, after a metal film made of theabove-described material is formed over the entire surface by, forexample, sputtering, a resist pattern (not illustrated) in apredetermined shape is formed on this laminated film by using apredetermined mask. Furthermore, the metal film is selectively etchedusing the resist pattern as a mask. In this process, the first electrodelayer 13 is formed to cover the surface of the planarizing film 218 andfill the contact section 124.

Next, the aperture-defining insulating film 24 is formed to fill a gapbetween the first electrode layers 13 next to each other. Specifically,a film of an inorganic insulating material such as SiO₂ may be formed byCVD (Chemical Vapor Deposition), for example, on the first electrodelayer 13 and the planarizing film 218, for example. This film is thenpatterned using a photolithography technique and an etching technique,so that a lower aperture-defining insulating film is formed. An upperaperture-defining insulating film made of the described-abovephotosensitive resin is formed at a predetermined position of the loweraperture-defining insulating film, specifically, at a positionsurrounding the light emission region of the pixel. Thus, theaperture-defining insulating film 24 including the upperaperture-defining insulating film and the lower aperture-defininginsulating film is formed.

After the aperture-defining insulating film 24 is formed, the surface ofthe base 11 is subjected to an oxygen plasma treatment, the surfacebeing on the side where the first electrode layer 13 and theaperture-defining insulating film 24 are formed, so that contaminantssuch as organic matters attached to the surface are removed to improvewettability. Specifically, the base 11 may be heated to a predeterminedtemperature, e.g., about 70 degrees C. to about 80 degrees C., and then,the plasma treatment in which oxygen is used as reactant gas underatmospheric pressure (i.e. an O₂ plasma treatment) is performed.

Following the plasma treatment, a water-repellent treatment (aliquid-repellent treatment) is performed to reduce, in particular,wettability on a top surface and a side surface of the upperaperture-defining insulating film. Specifically, this may be performedas follows. First, a plasma treatment (a CF₄ plasma treatment) in whichtetrafluoromethane is used as reactant gas under atmospheric pressure isperformed. Subsequently, the top surface and the side surface of theupper aperture-defining insulating film are caused to be liquidrepellent by cooling the base 11, which has been heated for the plasmatreatment, to ambient temperature, so that the wettability thereof isreduced. In it is to be noted that in this CF₄ plasma treatment, anexposed surface of the first electrode layer 13 and the loweraperture-defining insulating film may also be affected to some extent.However, in the CF₄ plasma treatment, materials such as ITO which is thematerial of the first electrode layer 13 and SiO₂ which is the materialof the lower aperture-defining insulating film have a low affinity tofluorine and therefore, the wettability improved by the oxygen plasmatreatment is maintained as it is.

Next, the organic layer 14 may be formed by laminating the holeinjection layer 14A, the hole transport layer 14B, the luminous layer14C, and the electron transport layer 14D made of the predeterminedmaterials and having thicknesses described above, by vapor deposition,for example, in this order. These layers are formed to completely coveran exposed part of the first electrode layer 13, in a region surroundedby the upper aperture-defining insulating film. Further, the secondelectrode layer 16 is formed over the entire surface, so as to face thefirst electrode layer 13 with the organic layer 14 interposedtherebetween. Subsequently, the second electrode layer 16 is patternedinto a predetermined shape, so that the EL element 10W is obtained.

The hole injection layer 14A may be formed using a coating method suchas spin coating or a droplet discharge method, other than vapordeposition. In this case, in particular, considering it is necessary toselectively arrange the material used in forming the hole injectionlayer 14A in the region surrounded by the upper aperture-defininginsulating film, preferably, an inkjet method which is a dropletdischarge method, or nozzle coating may be used.

Subsequently, the moisture-proof film 17 made of the material describedabove may be formed using a film formation method in which energy offilm-formation particles is small to the extent of not affecting a baselayer, such as vapor deposition and CVD. For instance, when themoisture-proof film 17 made of amorphous silicon nitride is formed, themoisture-proof film 17 is formed by CVD to have a film thickness ofabout 2 micrometer to about 3 micrometer. In this process, preferably,in order to prevent the luminance from declining due to deterioration ofthe organic layer 14, a film formation temperature may be set to roomtemperature, and the film may be formed on condition that stress of thefilm is minimized to prevent the moisture-proof film 17 from peelingoff. Further, preferably, the electron transport layer 14D, an electroninjection layer 14E, the second electrode layer 16, and themoisture-proof film 17 may be formed sequentially in the same filmforming apparatus without being exposed to the atmosphere. This preventsdeterioration of the organic layer 14 due to atmospheric water.

Finally, the filling layer 18 is provide on the moisture-proof film 17and bonded to the sealing substrate 19 with the seal section 23interposed therebetween. This completes the display unit 1.

(Function and Effects of Display Unit 1)

In this display unit 1, a scanning signal is supplied from thescanning-line driving circuit 130 to each pixel through the gateelectrode of the write transistor Tr2, and an image signal supplied fromthe signal-line driving circuit 120 is retained at the capacitor Csthrough the write transistor Tr2. In other words, the drive transistorTr1 is controlled to be ON/OFF according to this signal held by thecapacitor Cs, and thereby a driving current Id is injected into the ELelement 10W so that electron-hole recombination occurs, which causesemission of light. Since the display unit 1 may be of the top-surfacelight emission type (the top emission type), this light is taken outupon passing through the second electrode layer 16, the moisture-prooffilm 17, the filling layer 18, the color filter (not illustrated) ofeach color, and the sealing substrate 19. Image display (color imagedisplay) is thus performed in the display unit 1.

In a typical organic EL display unit, for example, an organic layer inan organic EL element is deteriorated by moisture absorption, leading toa decrease in light emission intensity or instability of light emissionin the organic EL element. Therefore, disadvantages such as lowstability over time and a short life have been pointed out.

In contrast, in the present embodiment, the planarizing film 218 in theperipheral region 110B is covered with the moisture-proof film 17.Therefore, the planarizing film 218 serving as the base layer of the ELelement 10W is sufficiently shielded from outside air containing water.As a result, it is possible to effectively prevent entrance of waterfrom the peripheral region 110B into the display region 110A, whileproviding a simple configuration. Therefore, deterioration in thelight-emitting element due to water is suppressed, achieving highoperational reliability. Moreover, it is also possible to achieve a slimbezel since it is not necessary to increase the distance between thedisplay region and the peripheral region, unlike the structure proposedin each of Japanese Unexamined Patent Application Publications No.2006-54111 and No. 2008-283222.

<Modifications>

Now, modifications (first to sixth modifications 1 to 6) of theabove-described embodiment will be described. It is to be noted that thesame elements as those of the above-described embodiment are providedwith the same reference numerals as those of the above-describedembodiment, and the description thereof will be omitted as appropriate.

<Modification 1>

FIG. 7 illustrates a cross-sectional configuration of a display unit 1Aaccording to the modification 1. In the present modification, amoisture-proof film 25 is provided between the protective film 217 andthe planarizing film 218, and a moisture-proof film 26 is providedbetween the planarizing film 218 and the aperture-defining insulatingfilm 24. The present modification is otherwise similar to theabove-described embodiment in terms of configuration. The moisture-prooffilms 25 and 26 are both made of an inorganic material having lowhygroscopicity as with the moisture-proof film 17, and extend from anedge of the planarizing film 218 and an edge of the aperture-defininginsulating film 24, respectively, toward the display region 110A.Providing the moisture-proof films 25 and 26 in addition to themoisture-proof film 17 reliably prevents entrance of water from anexternal environment into the EL element 10W. This is because it ispossible to reliably block the water which is otherwise likely to reachthe EL element 10W after passing through a boundary between theprotective film 217 and the planarizing film 218 or a boundary betweenthe planarizing film 218 and the aperture-defining insulating film 24.

<Modifications 2 to 4>

FIG. 8, FIG. 9A, and FIG. 9B illustrate cross-sectional configurationsof organic EL display units (hereinafter simply referred to as thedisplay units) 1B, 1C1, and 1C2 according to the modifications 2 to 4,respectively. Further, FIG. 9C illustrates an enlarged cross-sectionalconfiguration of a main part of a display unit 1C3 according to themodification 5. The modifications 2 to 5 are each provided with aseparation groove 27 in a region corresponding to the seal section 23,and each have otherwise a configuration similar to that of theabove-described embodiment. The separation groove 27 extends like a loopsurrounding the display region 110A on an XY plane, in a manner similarto the seal section 23. The separation groove 27 separates theaperture-defining insulating film 24 and the planarizing film 218provided in the display region 110A from the aperture-defininginsulating film 24 and the planarizing film 218 provided in theperipheral region 110B. A bottom of the separation groove 27 reaches theprotective film 217. The separation groove 27 is filled with themoisture-proof film 17 (a moisture-proof film 29 in the display unit1C3). In particular, in the display unit 1B (the modification 2), themoisture-proof film 17 directly covers an internal surface of theseparation groove 27. In each of the display units 1C1, 1C2, and 1C3(the modifications 3 to 5), a metal film 28 is further provided to coveran internal surface and a bottom surface of the separation groove 27. Itis to be noted that this metal film 28 may be, for example, made of thesame material as that of the second electrode layer 16 and providedintegrally with the second electrode layer 16, as exemplified by thedisplay unit 1C2 illustrated in FIG. 9B. Alternatively, as exemplifiedby the display units 1C1 and 1C3 illustrated in FIGS. 9A and 9C,respectively, when the metal film 28 is formed independently of thesecond electrode layer 16, a material different from that of the secondelectrode layer 16 may be selected. Still alternatively, as exemplifiedby the display unit 1C3, the moisture-proof film 29 in a three-layerstructure may be provided as a film independent of the moisture-prooffilm 17 covering the aperture-defining insulating film 24 and the secondelectrode layer 16 in the display region 110A. This moisture-proof film29 fills the inside of the separation groove 27 and covers theprotective film 217 and the planarizing film 218 in the peripheralregion 110B. In the moisture-proof film 29, first to third layers 291 to293 are laminated in this order on the protective film 217 and theplanarizing film 218. The first and third layers 291 and 293 may be, forexample, nitride films made of silicon nitride (SiNx) or the like, andthe second layer 292 may be, for example, an oxide film made of siliconoxide (SiOx) or the like. Further, in each of the display units 1B, 1C1,1C2, and 1C3, a plurality of separation grooves 27 may be provided.

In each of the display units 1B, 1C1, and 1C2, the separation groove 27is provided in addition to the moisture-proof film 17 and therefore,entrance of water from an external environment into the EL element 10Wis prevented more reliably. This is because the protective film 217 andthe planarizing film 218 forming a traveling path of the water aredisconnected by the display region 110A and the peripheral region 110B.

<Modification 6>

FIG. 10 illustrates a cross-sectional configuration of a display unit 1Daccording to the modification 6. The display unit 1D of the presentmodification has a moisture-proof film 34 in place of the moisture-prooffilm 17, and is otherwise similar to the above-described embodiment interms of configuration. The moisture-proof film 34 is providedcontinuously from an end face of the substrate 111 to an end face of thesealing substrate 19, and seals a region including the EL element 10Winterposed between the substrate 111 and the sealing substrate 19. Themoisture-proof film 34 may be made of, for example, an inorganicmaterial similar to that of the moisture-proof film 17.

In the display unit 1D, since the moisture-proof film 34 is provided,entrance of water from an external environment into the EL element 10Wis prevented with reliability. This is because the planarizing film 218and the aperture-defining insulating film 24 in the peripheral region110B are covered with the moisture-proof film 34, and sufficientlyshielded from outside air containing water. Further, when being formedof a conductive inorganic material, the moisture-proof film 34 isallowed to be used as a signal line. Such a conductive material may be,for example, a simple substance or an alloy of metallic elements such asplatinum (Pt), gold (Au), silver (Ag), chromium (Cr), tungsten (W),nickel (Ni), copper (Cu), iron (Fe), cobalt (Co), tantalum (Ta),aluminum (Al), neodymium (Nd), and molybdenum (Mo). As such an alloy,for instance, an Ag—Pd—Cu alloy or an Al—Nd alloy may be used. TheAg—Pd—Cu alloy may contain silver as a main component and about 0.3 wt %to about 1 wt % of palladium (Pd) as well as about 0.3 wt % to about 1wt % of copper. In this case, one end of the connection wiring 31 suchas an FPC which establishes connection to outside may be embedded in themoisture-proof film 34. It is to be noted that the moisture-proof film34 and the seal section 23 may be provided as a common element.

APPLICATION EXAMPLES

Application examples of the display units according to the embodimentand modifications described above (i.e. the display units 1, and 1A to1D) will be described below. The display unit according to each of theabove-described embodiment and the modifications is applicable toelectronic apparatuses in all fields, which display externally-inputtedimage signals or internally-generated image signals as still or movingimages. The electronic apparatuses may include, for example, televisionreceivers, digital cameras, laptop computers, portable terminals such asportable telephones, video cameras, and the like.

(Module)

The display unit according to any of the above-described embodiment andthe modifications may be incorporated, for instance, as a moduleillustrated in FIG. 11, into any of various kinds of electronicapparatuses such as first to sixth application examples 1 to 6 describedlater. This module may be formed, for example, by providing a region 210exposed from the sealing substrate 19, etc., at one side of thesubstrate 111. In this exposed region 210, an external connectionterminal (not illustrated) is formed by extending wiring of thesignal-line driving circuit 120 and the scanning-line driving circuit130. The external connection terminal may be provided with a flexibleprinted circuit (FPC) 220 for input and output of signals.

Application Example 1

FIG. 12 illustrates an appearance of a television receiver to which thedisplay unit according to any of the above-described embodiment and themodifications is applied. This television receiver may have, forexample, an image-display screen section 300 that includes a front panel310 and a filter glass 320. The image-display screen section 330 isconfigured using the display unit according to any of theabove-described embodiment and the modifications.

Application Example 2

FIGS. 13A and 13B each illustrate an appearance of a digital camera towhich the display unit according to any of the above-describedembodiment and the modifications is applied. This digital camera mayinclude, for example, a flash emitting section 410, a display section420, a menu switch 430, and a shutter release 440. The display section420 is configured using the display unit according to any of theabove-described embodiment and the modifications.

Application Example 3

FIG. 14 illustrates an appearance of a laptop computer to which thedisplay unit according to any of the above-described embodiment and themodifications is applied. This laptop computer may include, for example,a main body section 510, a keyboard 520 provided to enter characters andthe like, and a display section 530 displaying an image. The displaysection 530 is configured using the display unit according to any of theabove-described embodiment and the modifications.

Application Example 4

FIG. 15 illustrates an appearance of a video camera to which the displayunit according to any of the above-described embodiment and themodifications is applied. This video camera may include, for example, amain body section 610, a lens 620 disposed on a front face of this mainbody section 610 to shoot an image of a subject, a start/stop switch 630used in shooting, and a display section 640. The display section 640 isconfigured using the display unit according to any of theabove-described embodiment and the modifications.

Application Example 5

FIGS. 16A and 16B each illustrate appearances of a portable telephone towhich the display unit according to any of the above-describedembodiment and the modifications is applied. This portable telephone maybe, for example, a unit in which an upper housing 710 and a lowerhousing 720 are connected by a coupling section (a hinge section) 730,and may include a display 740, a sub-display 750, a picture light 760,and a camera 770. The display 740 or the sub-display 750 is configuredusing the display unit according to any of the above-describedembodiment and the modifications.

Application Example 6

FIGS. 17A and 17B each illustrate an appearance configuration of aso-called tablet personal computer (PC). This tablet PC may include, forexample, a display section 810, a non-display section 820 such as ahousing supporting the display section 810, and an operation section 830such as a power switch. It is to be noted that the operation section 830may be provided either on a front face of the non-display section 820 asillustrated in FIG. 17A, or on a top surface of the same as illustratedin FIG. 17B. The display section 810 is a touch screen provided with aposition input function (a pointing function) in addition to an imagedisplay function (a touch panel).

<Other Modifications>

The technology has been described with reference to the exampleembodiment and some modifications, but is not limited thereto, and maybe variously modified. For example, in the above-described embodiment,the modifications, and the application examples, entrance of water intothe EL element 10W is prevented by covering the planarizing film 218 andthe like in the peripheral region 110B with the moisture-proof films 17and/or 29, but the present disclosure is not limited thereto. Forinstance, as exemplified by a display unit 1E illustrated in FIG. 18,the separation groove 27 may be provided in a region corresponding tothe seal section 23 in place of the moisture-proof film 17, the sealsection 23 may be formed of a metallic material, and the separationgroove 27 may be filled with a part of the seal section 23 (a seventhmodification). As the metallic material applied to the seal section 23,there may be used, for example, a simple substance or an alloy ofmetallic elements such as platinum (Pt), gold (Au), silver (Ag),chromium (Cr), tungsten (W), nickel (Ni), copper (Cu), iron (Fe), cobalt(Co), tantalum (Ta), aluminum (Al), neodymium (Nd), and molybdenum (Mo).To be more specific, an Ag—Pd—Cu alloy or an Al—Nd alloy may be used.The Ag—Pd—Cu alloy may contain silver as a main component and about 0.3wt % to about 1 wt % of palladium (Pd) as well as about 0.3 wt % toabout 1 wt % of copper. Alternatively, a dumet wire (a copper wire usinga nickel-iron alloy wire as a core (i.e. a nickel-iron alloy wirecovered with copper)) may be applied to the seal section 23.

In the display unit 1E, since the separation groove 27 filled with apart of the seal section 23 made of the metallic material is provided,entrance of water from an external environment into the EL element 10Wis prevented more reliably. Further, the seal section 23 is also allowedto be used as wiring. The seal section 23 may be formed using a mask,through vacuum vapor deposition, sputtering, ion plating, or plating,for example. Furthermore, when the dumet wire is used, the seal section23 may be formed by welding the dumet wire by application of heat with aburner or the like. It is to be noted that at the time of forming theseal section 23, one end of leading wiring (not illustrated) such as anFPC establishing connection to outside may be embedded in the sealsection 23.

Further, in the technology, as exemplified by a display unit 1F1illustrated in FIG. 19A, for example, the separation groove 27 may beprovided in a region corresponding to the seal section 23, an innersurface of the separation groove 27 may be covered with a metal layer28, and the separation groove 27 may be filled with the moisture-prooffilm 17 (an eighth modification). Alternatively, as exemplified by adisplay unit 1F2 illustrated in FIG. 19B, the moisture-proof film 29having a three-layer structure and filling the inside of the separationgroove 27 may be provided independently of the moisture-proof film 17.In the moisture-proof film 29, first to third Layers 291 to 293 arelaminated in this order. The first and third layers 291 and 293 may beboth nitride films made of silicon nitride (SiNx) or the like, forexample, and the second layer 292 may be an oxide film made of siliconoxide (SiOx) or the like (a ninth modification). Still alternatively, asexemplified by a display unit 1G illustrated in FIG. 20, two separationgrooves 27A and 27B may be provided and filled with the metal layer 28(a tenth modification).

In the technology, as exemplified by a display unit 1H1 illustrated inFIG. 21A, for example, the moisture-proof film 17 may be providedbetween the aperture-defining insulating film 24 and the organic layer14 in the display region 110A (an eleventh modification). This makes itpossible to prevent the EL element 10W from deteriorating due to watercontained in the aperture-defining insulating film 24 in the displayregion 110A. Further, as exemplified by a display unit 1H2 illustratedin FIG. 21B, the moisture-proof film 26 may be also provided between theplanarizing film 218 and the aperture-defining insulating film 24 (atwelfth modification). It is to be noted that, in order to form each ofthe display units 1H1 and 1H2, after the aperture-defining insulatingfilm 24 is formed, a predetermined material (e.g. SiN) having a moistureresistance property and an insulation property may be formed to coverthe aperture-defining insulating film 24 by CVD, a lithography method,and etching. Subsequently, the organic layer 14 may be formed by, forexample, vapor deposition, and then, the second electrode layer 16 isformed to obtain each of the display units 1H1 and 1H2.

Further, in the technology, as exemplified by a display unit 1Jillustrated in FIGS. 22A and 22B (a thirteenth modification), forexample, a moisture-proof film 35 made of insulating resin having highmoisture resistance may be provided in place of the moisture-proof film17. In the display unit 1J, the moisture-proof film 35 continuouslyextends from an end face of the substrate 111 to an end face of thesealing substrate 19, and seals a region including the EL element 10Winterposed between the substrate 111 and the sealing substrate 19. Asillustrated, for example, in FIG. 23, a predetermined resin is appliedalong an outer edge of the sealing substrate 19 and then hardened toform the moisture-proof film 35 so that the display unit 1J is obtained.Furthermore, as exemplified by a display unit 1K illustrated in FIGS. 24and 24B (a fourteenth modification), for example, the moisture-prooffilm 35 in a two-layer structure may be provided by forming a resinlayer 351, and then forming an inorganic layer 352 by depositing aninorganic material on the resin layer 351 by sputtering or the like. Itis to be noted that the moisture-proof film 35 may be formed by directlydepositing an inorganic material or a metallic material without formingthe resin layer. For this inorganic material, an inorganic materialhaving low hygroscopicity such as silicon oxide (SiOx), silicon nitride(SiNx), silicon oxynitride (SiNxOy), silicon carbide (SiCx), titaniumoxide (TiOx), and aluminum oxide (AlxOy) may be suitable. Meanwhile, forthe metallic material, a simple substance or an alloy of metallicelements such as platinum (Pt), gold (Au), silver (Ag), chromium (Cr),tungsten (W), nickel (Ni), copper (Cu), iron (Fe), cobalt (Co), tantalum(Ta), titanium (Ti), aluminum (Al), neodymium (Nd), and molybdenum (Mo)may be suitable. Specifically, for example, an Ag—Pd—Cu alloy, an Al—Ndalloy, and a dumet wire (a copper wire using a nickel-iron alloy wire asa core (i.e. a nickel-iron alloy wire covered with copper)) and the likemay be suitable. The Ag—Pd—Cu alloy may contain silver as a maincomponent and about 0.3 wt % to about 1 wt % of palladium (Pd) as wellas about 0.3 wt % to about 1 wt % of copper. Still furthermore, asexemplified by a display unit 1L illustrated in FIG. 25 (a fifteenthmodification), for example, a region including the EL element 10Wbetween the substrate 111 and the sealing substrate 19 may be sealed bya glass layer 37. The display unit 1L may be obtained as follows. Afterfritted glass is applied along an outer edge of the substrate 111, thesubstrate 111 and the sealing substrate 19 are welded by forming amoisture-proof film 37 made of a glass layer by irradiation of thefritted glass with a laser as illustrated FIG. 26, for example.Moreover, as exemplified by a display unit 1M illustrated in FIG. 27 (asixteenth modification), for example, the moisture-proof films 35 and 37may be each formed after processing the respective end faces of thesubstrate 111 and the sealing substrate 19 into a concave shape.

Further, in the technology, the separation groove 27 may be provided ina region corresponding to the seal section 23 in place of themoisture-proof film 17, and an inner surface of the separation groove 27may be covered with the metal layer 28 and a moisture-proof film in athree-layer structure. The moisture-proof film in the three-layerstructure may be a film in which, for example, an oxide film made ofsilicon oxide (SiOx) or the like may be interposed between a pair ofnitride films made of silicon nitride (SiNx) or the like, or interposedbetween a pair of carbide films made of silicon carbide (SiCx) or thelike. Alternatively, the moisture-proof film in the three-layerstructure may be a film in which a nitride film made of silicon nitride(SiNx) or the like or a carbide film made of silicon carbide (SiCx) orthe like may be interposed between a pair of oxide films made of siliconoxide (SiOx) or the like. Still alternatively, the moisture-proof filmin the three-layer structure may be a film in which, for example, anoxide film made of silicon oxide (SiOx) or the like may be interposedbetween a pair of nitride films made of silicon nitride (SiNx) or thelike. It is to be noted that extending the moisture-proof film in thethree-layer structure up to the peripheral region 110B and covering theplanarizing film 218 with the moisture-proof film 34 improves themoisture resistance property, which is thus preferable.

Further, in the above-described embodiment, the case in which all theorganic light-emitting elements emit white light and each color light isextracted through the color filter provided separately has been taken asan example, but the technology is not limited thereto. For instance, theorganic light-emitting elements emitting red light, green light, andblue light, respectively, may be provided by assigning different colorsfor the organic layers 14 by using predetermined materials.

Alternatively, the display unit may have a configuration in which redlight, green color light, blue light, and yellow light are taken out byusing organic light-emitting elements 10Y and 10B emitting yellow lightand blue light, respectively, and color filters of red, green, blue, andyellow. Still alternatively, the display unit may have a configurationin which red light, green color light, and blue light are taken out byusing organic light-emitting elements 10Y and 10B emitting yellow lightand blue light, respectively, and color filters of red, green, and blue.

Moreover, the technology is not limited to the material, laminationorder, film formation method, or the like of each of the layersdescribed above in the example embodiment, the modifications, and theapplication examples. For instance, although the case in which the firstelectrode layer 13 is provided as an anode and the second electrodelayer 16 is provided as a cathode has been described in the embodiment,the first electrode layer 13 may be provided as a cathode and the secondelectrode layer 16 may be provided as an anode. It is to be noted thatwhen the first electrode layer 13 is used as a cathode, preferably, thefirst electrode layer 13 may be configured using a material having ahigh hole injection property. However, a material having an obstacle tohole injection due to existence of an oxide film on the surface or asmall work function, such as an aluminum alloy, may be used for thefirst electrode layer 13 by providing an appropriate hole injectionlayer. Furthermore, although the example embodiment, the modifications,and the application examples have been described with reference to thespecific configuration of the light-emitting section 20, other layer maybe further provided. For instance, a hole-injection thin-film layerwhich may be made of chromium oxide (III) (Cr₂O₃), ITO (Indium-TinOxide: an oxide-mixed film of indium (In) and tin (Sn)), or the like maybe provided between the first electrode layer 13 and the organic layer14.

Furthermore, the technology encompasses any possible combination of someor all of the various embodiments described herein and incorporatedherein.

It is possible to achieve at least the following configurations from theabove-described example embodiments of the disclosure.

-   (1) A display unit, including:

a first substrate and a second substrate that are disposed to face eachother;

a first organic insulating layer provided on the first substrate;

a plurality of light-emitting elements arrayed in a display region, thedisplay region being provided on the first organic insulating layer andfacing the second substrate; and

a first moisture-proof film covering the first organic insulating layerin a peripheral region, the peripheral region being provided on thefirst substrate and surrounding the display region.

-   (2) The display unit according to (1), further including a second    organic insulating layer provided on the first organic insulating    layer, the second organic insulating layer separating the    light-emitting elements from one another and defining light emission    regions of the light-emitting elements,

wherein the first moisture-proof film covers the second organicinsulating layer in the peripheral region.

-   (3) The display unit according to (2), wherein the first    moisture-proof film covers the second organic insulating layer in    the display region.-   (4) The display unit according to any one of (1) to (3), wherein the    first moisture-proof film covers the first organic insulating layer    continuously from the display region to the peripheral region.-   (5) The display unit according to any one of (1) to (4), further    including a second moisture-proof film provided between the first    organic insulating layer and the second organic insulating layer.-   (6) The display unit according to any one of (1) to (5), further    including:

an inorganic insulating layer provided between the first substrate andthe first organic insulating layer; and

a third moisture-proof film provided between the inorganic insulatinglayer and the first organic insulating layer.

-   (7) The display unit according to any one of (1) to (6), wherein the    first moisture-proof film includes one of a silicon nitride    represented by SiNx and a metallic material.-   (8) The display unit according to any one of (1) to (7), further    including a separation groove that separates the first organic    insulating layer provided in the display region from the first    organic insulating layer provided in the peripheral region.-   (9) The display unit according to (8), wherein the first    moisture-proof film covers an inner surface of the separation    groove.-   (10) The display unit according to (8), further including a metallic    material layer that covers an inner surface of the separation    groove.-   (11) The display unit according to any one of (1) to (10), further    including a seal section provided along a peripheral edge section on    a counter surface of the second substrate and partitioning the    display region and the peripheral region, the counter surface facing    the first substrate.-   (12) The display unit according to (11), wherein the seal section    includes a conductive material.-   (13) The display unit according to any one of (1) to (12), wherein    the first moisture-proof film is provided from an end face of the    first substrate to an end face of the second substrate, and seals a    region provided between the first substrate and the second    substrate.-   (14) The display unit according to (13), wherein the first    moisture-proof film includes one of a metallic material and an    inorganic insulating material.-   (15) An electronic apparatus provided with a display unit, the    display unit including:-   a first substrate and a second substrate that are disposed to face    each other;

a first organic insulating layer provided on the first substrate;

-   a plurality of light-emitting elements arrayed in a display region,    the display region being provided on the first organic insulating    layer and facing the second substrate; and-   a first moisture-proof film covering the first organic insulating    layer in a peripheral region, the peripheral region being provided    on the first substrate and surrounding the display region.-   (16) A display region comprising:-   a first substrate;-   a light emitting element on the first substrate;-   an electroluminescence element in the light emitting element;-   a planarizing film on the electroluminescence element, and-   a first moisture proof film located at least at a periphery of the    electroluminescence element.-   (17) The display region according to (16) further comprising a    second moisture proof film is in-between a protective film and the    planarizing film.-   (18) The display region according to (17) further comprising a third    moisture proof film is in-between the planarizing film and a    protective film.-   (19) The display region according to (16) further comprising a    separation groove in a seal section.-   (20) The display region according to (19) wherein the separation    grove is filled with the first moisture proof film.-   (21) The display region according to (19) wherein the inner surfaces    of the separation grove are lined with a metal film.-   (22) A display region comprising:-   a substrate;-   a light emitting element on the substrate;-   an electroluminescence layer in the light emitting element;-   a seal substrate above the light emitting layer;-   a seal section between the seal substrate and the substrate; and-   a first separation groove in the seal section.-   (23) The display region according to (22) wherein the first    separation groove is filled with at least a portion of the seal    section.-   (24) The display region according to (22) wherein the inner surfaces    of the first separation groove are lined with a metal film.-   (25) The display region according to (23) further comprising a    second separation groove in the seal section.-   (26) The display region according to (25) wherein the inner surfaces    of the second separation groove are lined with a metal film.-   (27) The display region according to (22) wherein a moisture proof    film extends from an end face of the seal substrate to an end face    of the seal substrate.-   (28) The display region according to (27) wherein the moisture proof    film comprises an insulating resin having high moisture resistance.-   (29) The display region according to (27) wherein the moisture proof    film comprises a resin layer and an inorganic layer.-   (30) The display region according to (27) wherein the moisture proof    film is a glass layer.-   (31) A display region comprising:-   a first substrate;-   a second substrate above the first substrate;-   a light emitting element in-between the first substrate and the    second substrate;-   an electroluminescence element in the light emitting element;-   a planarizing film on the electroluminescence element, and-   a moisture proof film extending from an end of the second substrate    to an end of the first substrate.-   (32) The display region according to (31) wherein the moisture proof    film comprises a resin layer an and inorganic layer.-   (33) The display region according to (31) wherein the moisture proof    film is a glass layer.-   (34) A display unit comprising:-   a display region;-   a peripheral region at a periphery of the display region; and-   a first moisture proof film located at least at a periphery of the    peripheral region,

wherein,

the display region comprises (i) a pixel circuit layer, (ii) a firstinsulating layer on the pixel circuit layer, and (iii) a light emittingelement on the first insulating layer, and

at least a part of the first moisture proof film covers at least aportion of the first insulating layer.

-   (35) The display unit according to (34) further comprising a second    insulating layer on the first insulating layer, the second    insulating film outlining a light emission region.-   (36) The display unit according to (34) wherein the first moisture    proof film covers the first insulating layer from the display region    to the peripheral region.-   (37) The display unit according to (34) further comprising a second    moisture proof film between the first insulating layer and the    second insulating layer.

The present disclosure contains subject matter related to that disclosedin Japanese Priority Patent Application JP 2012-170618 filed in theJapan Patent Office on Jul. 31, 2012 and Japanese Priority PatentApplication JP 2012-176507 filed in the Japan Patent Office on Aug. 8,2012, the entire contents of each of which is hereby incorporated byreference.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

REFERENCES SIGNS LIST

-   10W white organic EL element-   11 base-   111 substrate-   112 pixel-driving-circuit formation layer-   12 light-emitting element formation layer-   13 first electrode layer-   14 organic layer-   14A hole injection layer-   14B hole transport layer-   14C luminous layer-   14D electron transport layer-   16 second electrode layer-   17, 25, 26, 29, 34, 35 moisture-proof film-   18 filling layer-   19 sealing substrate-   20 light-emitting section-   23 seal section-   24 aperture-defining insulating film-   124 contact section-   27 separation groove-   28 metal film-   110A display region-   110B peripheral region-   120 signal-line driving circuit-   120A signal line-   130 scanning-line driving circuit-   130A scanning line-   140 pixel driving circuit-   217 protective film-   218 planarizing film-   Cs capacitor (a retention capacitor)-   Tr1 drive transistor-   Tr2 write transistor

1. A display region comprising: a first substrate; a light emittingelement on the first substrate; an electroluminescence element in thelight emitting element; a planarizing film on the electroluminescenceelement, and a first moisture proof film located at least at a peripheryof the electroluminescence element.
 2. The display region according toclaim 1 further comprising a second moisture proof film is in-between aprotective film and the planarizing film.
 3. The display regionaccording to claim 2 further comprising a third moisture proof film isin-between the planarizing film and a protective film.
 4. The displayregion according to claim 1 further comprising a separation groove in aseal section.
 5. The display region according to claim 4 wherein theseparation grove is filled with the first moisture proof film.
 6. Thedisplay region according to claim 4 wherein the inner surfaces of theseparation grove are lined with a metal film.
 7. A display regioncomprising: a substrate; a light emitting element on the substrate; anelectroluminescence layer in the light emitting element; a sealsubstrate above the light emitting layer; a seal section between theseal substrate and the substrate; and a first separation groove in theseal section.
 8. The display region according to claim 7 wherein thefirst separation groove is filled with at least a portion of the sealsection.
 9. The display region according to claim 7 wherein the innersurfaces of the first separation groove are lined with a metal film. 10.The display region according to claim 8 further comprising a secondseparation groove in the seal section.
 11. The display region accordingto claim 10 wherein the inner surfaces of the second separation grooveare lined with a metal film.
 12. The display region according to claim 7wherein a moisture proof film extends from an end face of the sealsubstrate to an end face of the seal substrate.
 13. The display regionaccording to claim 12 wherein the moisture proof film comprises aninsulating resin having high moisture resistance.
 14. The display regionaccording to claim 12 wherein the moisture proof film comprises a resinlayer and an inorganic layer.
 15. The display region according to claim12 wherein the moisture proof film is a glass layer.
 16. A displayregion comprising: a first substrate; a second substrate above the firstsubstrate; a light emitting element in-between the first substrate andthe second substrate; an electroluminescence element in the lightemitting element; a planarizing film on the electroluminescence element,and a moisture proof film extending from an end of the second substrateto an end of the first substrate.
 17. The display region according toclaim 16 wherein the moisture proof film comprises a resin layer an andinorganic layer.
 18. The display region according to claim 16 whereinthe moisture proof film is a glass layer.
 19. A display unit comprising:a display region; a peripheral region at a periphery of the displayregion; and a first moisture proof film located at least at a peripheryof the peripheral region, wherein, the display region comprises (i) apixel circuit layer, (ii) a first insulating layer on the pixel circuitlayer, and (iii) a light emitting element on the first insulating layer,and at least a part of the first moisture proof film covers at least aportion of the first insulating layer.
 20. The display unit according toclaim 19 further comprising a second insulating layer on the firstinsulating layer, the second insulating film outlining a light emissionregion.
 21. The display unit according to claim 19 wherein the firstmoisture proof film covers the first insulating layer from the displayregion to the peripheral region.
 22. The display unit according to claim19 further comprising a second moisture proof film between the firstinsulating layer and the second insulating layer.